ELECTRONIC COMPONENT MODULE AND PROCESS OF MANUFACTURING SUBSTRATE AND THE ELECTRONIC COMPONENT MODULE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component module capable of fixing a shield case to a substrate without causing misalignment.SOLUTION: The electronic component module includes: a substrate on which electronic components are mounted; and a shield case that covers the electronic components and is mounted to the substrate. The substrate includes a convex post part that is formed at a position along a side wall of the shield case so as to protrude by electroplating from a surface and is soldered with the shield case.