摘要 |
本发明的目的在于提供一种于例如有机EL元件等被涂布物上,可形成凹凸或塌凹少、表面的平滑性高的硬化物层的热硬化性组成物。本发明的热硬化性组成物包括:(A)1分子内具有2个以上的阳离子聚合性官能基的阳离子聚合性化合物;(B)热阳离子聚合起始剂;(C)聚醚化合物(但是,具有所述阳离子聚合性官能基的化合物除外);以及(D)调平剂;且藉由E型黏度计所测定的于25℃、2.5rpm下的黏度为50mPa.s~30000mPa.s。;The thermosetting composition includes: (A) a cationic polymerizable compound having 2 or more cationic polymerizable function group within a molecule, (B) a thermal cationic polymerization initiator, (C) a polyether compound (but, a compound having the cationic polymerizable function group is excluded), and (D) leveling agent; wherein a viscosity is 50 mPa s~ 30000 mPa s by the E-type viscometer at 25℃ |