发明名称 |
MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE. |
摘要 |
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate. |
申请公布号 |
MX2014006030(A) |
申请公布日期 |
2015.01.16 |
申请号 |
MX20140006030 |
申请日期 |
2012.11.08 |
申请人 |
LUXVUE TECHNOLOGY CORPORATION |
发明人 |
ANDREAS BIBL;JOHN A. HIGGINSON;HUNG-FAI STEPHEN LAW;HSIN-HUA HU |
分类号 |
H01L21/677;B65G47/91;B65G49/07;H05K13/02;H05K13/04 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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