发明名称 |
Current lead with a configuration to reduce heat load transfer in an alternating electrical current environment |
摘要 |
A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead. |
申请公布号 |
US8933335(B2) |
申请公布日期 |
2015.01.13 |
申请号 |
US201113273927 |
申请日期 |
2011.10.14 |
申请人 |
Varian Semiconductor Equipment Associates, Inc. |
发明人 |
Citver Gregory;Sinclair Frank;Lischer D. Jeffrey;Desai Nandishkumar |
分类号 |
H01B5/00;H01F6/06 |
主分类号 |
H01B5/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A current lead comprising:
a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead, the current lead comprising a first portion configured to operate at a first temperature and a second portion configured to operate at a second temperature higher than the first temperature, wherein temperature gradient is exhibited along a length of the current lead, wherein the conductive material surrounds an inner portion, the conductive material in the first portion having a first thickness that extends from a surface of the first portion to a surface of the inner portion, the conductive material in the second portion having a second thickness that extends from a surface of the second portion to the surface of the inner portion, and the second thickness being greater than the first thickness. |
地址 |
Gloucester MA US |