发明名称 Current lead with a configuration to reduce heat load transfer in an alternating electrical current environment
摘要 A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead.
申请公布号 US8933335(B2) 申请公布日期 2015.01.13
申请号 US201113273927 申请日期 2011.10.14
申请人 Varian Semiconductor Equipment Associates, Inc. 发明人 Citver Gregory;Sinclair Frank;Lischer D. Jeffrey;Desai Nandishkumar
分类号 H01B5/00;H01F6/06 主分类号 H01B5/00
代理机构 代理人
主权项 1. A current lead comprising: a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead, the current lead comprising a first portion configured to operate at a first temperature and a second portion configured to operate at a second temperature higher than the first temperature, wherein temperature gradient is exhibited along a length of the current lead, wherein the conductive material surrounds an inner portion, the conductive material in the first portion having a first thickness that extends from a surface of the first portion to a surface of the inner portion, the conductive material in the second portion having a second thickness that extends from a surface of the second portion to the surface of the inner portion, and the second thickness being greater than the first thickness.
地址 Gloucester MA US