| 发明名称 | Process for treatment of substrates with water vapor or steam | ||
| 摘要 | A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors. | ||
| 申请公布号 | US8920577(B2) | 申请公布日期 | 2014.12.30 |
| 申请号 | US201012873635 | 申请日期 | 2010.09.01 |
| 申请人 | Tel FSI, Inc. | 发明人 | DeKraker David;Butterbaugh Jeffery W.;Williamson Richard E. |
| 分类号 | B08B3/02;B08B3/04;B08B3/08;B08B3/10;G03F7/42;H01L21/311;H01L21/67 | 主分类号 | B08B3/02 |
| 代理机构 | Kagan Binder, PLLC | 代理人 | Kagan Binder, PLLC |
| 主权项 | 1. A method of treating a substrate, comprising a) placing a substrate having material on a surface thereof in a treatment chamber; b) directing a stream of a liquid treatment composition comprising sulfuric acid and/or its desiccating species and precursors to impinge the substrate surface; and c) directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition, wherein the stream of liquid treatment composition and the stream of water vapor originate from separate orifices and at least partially externally intersect prior to impinging the surface of the substrate in an amount effective to increase the temperature of the liquid treatment composition above the temperature of the liquid treatment composition prior to exposure to the water vapor, forming liquid aerosol droplets. | ||
| 地址 | Chaska MN US | ||