发明名称 RF MODULE
摘要 <p>According to the present invention, an RF module comprises: a printed circuit board; a chassis which is embedded with a printed circuit board and comprises a containing groove; and a body which penetrates the chassis and is installed in the containing groove. The printed circuit board comprises an antenna unit which receives and transmits an external signal, and a plurality of capacitors is connected between a ground terminal of the antenna unit and a ground terminal of the printed circuit board.</p>
申请公布号 KR101477399(B1) 申请公布日期 2014.12.29
申请号 KR20130075747 申请日期 2013.06.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, KYO SANG;HAN, KI PIL
分类号 H04N5/44;H03J1/00;H04N5/50 主分类号 H04N5/44
代理机构 代理人
主权项
地址