发明名称 |
RF MODULE |
摘要 |
<p>According to the present invention, an RF module comprises: a printed circuit board; a chassis which is embedded with a printed circuit board and comprises a containing groove; and a body which penetrates the chassis and is installed in the containing groove. The printed circuit board comprises an antenna unit which receives and transmits an external signal, and a plurality of capacitors is connected between a ground terminal of the antenna unit and a ground terminal of the printed circuit board.</p> |
申请公布号 |
KR101477399(B1) |
申请公布日期 |
2014.12.29 |
申请号 |
KR20130075747 |
申请日期 |
2013.06.28 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, KYO SANG;HAN, KI PIL |
分类号 |
H04N5/44;H03J1/00;H04N5/50 |
主分类号 |
H04N5/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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