PRESSURE SENSOR AND METHOD OF PACKAGING SAME

摘要

A method of packaging a pressure sensor die begins with patterning and etching a metal strip and forming metal traces on the strip. Further build-up is performed to transform the metal strip into a layered substrate. Cavity walls are formed on one side of the strip with a molding process and then the metal on the back side of the strip is removed. Next semiconductor dies are attached to the strip within the cavities and electrically connected to pads formed on the surface of the strip and/or to pads on other ones of the dies. A gel coating is deposited over the dies and then a metal lid is secured over the cavity. The strip is then singulated along ones of the cavity walls to form multiple sensor devices.

主权项

1. A method of packaging a pressure sensor die, comprising the steps of:
forming a coreless substrate on a sheet of metal foil, wherein the forming includes forming one or more die attach areas and a plurality of electrical contacts on an upper surface of the substrate; forming side walls at predetermined locations on the upper substrate upper surface; attaching a first die to a first one of the die attach areas; attaching a pressure sensor die to a second one of the die attach areas; electrically connecting the first die to the plurality of electrical contacts on the substrate upper surface; electrically connecting the pressure sensor die to the first die; dispensing a gel material onto a top surface of at least the pressure sensor die; and attaching a lid over the first die and the pressure sensor die, wherein the lid is supported by the side walls.