| 发明名称 |
Three-Dimensional Laminated Wiring Substrate |
| 摘要 |
A three-dimensional laminated wiring substrate is provided and includes a plurality of wiring substrates disposed on top of each other. Each of the plurality of wiring substrates includes an insulating film and a conductor pattern. The insulating film is disposed along a surface to provide a three-dimensional surface. The conductor pattern is disposed on and extending along the three-dimensional surface. |
| 申请公布号 |
US2014368969(A1) |
申请公布日期 |
2014.12.18 |
| 申请号 |
US201414472976 |
申请日期 |
2014.08.29 |
| 申请人 |
Tyco Electronics Japan G.K. |
发明人 |
Kimura Takeshi |
| 分类号 |
H05K1/02;H01G4/005;H01G4/30 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A three-dimensional laminated wiring substrate comprising:
a plurality of wiring substrates disposed on top of each other, each of the plurality of wiring substrates having:
an insulating film disposed along a surface thereof to provide a three-dimensional surface; anda conductor pattern disposed on and extending along the three-dimensional surface. |
| 地址 |
Kanagawa JP |
