SUBSTRATE HAVING PILLAR GROUP AND SEMICONDUCTOR PACKAGE HAVING PILLAR GROUP

摘要

The present disclosure provides a substrate and a semiconductor package. The substrate includes a body, at least one pad group, a plurality of traces and at least one pillar group. The pad group includes a plurality of pads. Each pad has at least one inner side and at least one outer side. The inner side of a first pad is faced to the inner side of an adjacent second pad with a spaced section between. Each pillar group includes a plurality of pillars disposed on respective ones of the pads. The use of pad groups having multiple pads on which to form pillars allows an increase in the number of the pillars available in a given area so as to increase the amount of I/O connections. Furthermore, for a given number of I/O connections, the area occupied by the pads, pillars and traces can be reduced.

主权项

1. A substrate, comprising:
a body having a surface; a conductive pad group disposed on the surface, wherein the conductive pad group comprises a plurality of conductive pads each with at least one inner side and at least one outer side, a first inner side of a first conductive pad is faced towards a second inner side of an adjacent second conductive pad, and the first inner side and the second inner side are separated by a spaced section; a plurality of conductive traces electrically connected to respective ones of the conductive pads; and a metal pillar group formed on the conductive pad group, the metal pillar group including a plurality of metal pillars formed on corresponding ones of the conductive pads.