| 摘要 |
Provided is an optical semiconductor device which shows little degradation even if used in a severe environment, can prevent color change in an electrode, and can improve the adhesion of a molded article to a member that is in contact with the molded article. A white curable composition for optical semiconductor devices according to the present invention, said white curable composition being used to obtain a molded article which is placed beside an optical semiconductor element in an optical semiconductor device, in which an area surrounded by the inner surface is packed with a sealing agent before using to seal the optical semiconductor element, and which is provided with an opening for taking out light emitted by the optical semiconductor element, comprises an epoxy compound having an epoxy group, an acid anhydride curing agent, titanium oxide, spherical silica and ground silica, wherein the average grain size of the spherical silica is 5-100 mum inclusive. |
