| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus in which utilization efficiency of process liquid can be enhanced while making the thickness uniform, and to provide a film deposition method.SOLUTION: A film deposition apparatus supplies process liquid from a moving nozzle to the surface of a rotating substrate, coats the surface of a substrate with the process liquid spirally, and forms a film from the process liquid thus applied by rotation of the substrate. The film deposition apparatus includes a holding section for holding a substrate, a drive section for rotating the holding section, a process liquid supply section for supplying the process liquid to the surface of the substrate held in the holding section, and a control section for controlling at least the drive section. The control section forms a film from the process liquid thus applied, by rotating the holding section at a second rotational speed slower than the first rotational speed when applying the process liquid. |
