发明名称 Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
摘要 A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
申请公布号 US8902565(B2) 申请公布日期 2014.12.02
申请号 US201113114126 申请日期 2011.05.24
申请人 Kemet Electronics Corporation 发明人 McConnell John E.;Bultitude John;Phillips Reggie;Hill Robert Allen;Renner Garry L.;Lessner Philip M.;Chacko Antony P.;Bell Jeffrey;Brown Keith
分类号 H01G4/228;H01G4/06;H01G4/30;B23K1/00;B23K1/20;B23K35/36;H01G4/232;B23K1/008;B23K35/02;H01G4/005;B23K1/005 主分类号 H01G4/228
代理机构 Perkins Law Firm, LLC 代理人 Guy Joseph T.;Perkins Law Firm, LLC
主权项 1. A multilayered ceramic capacitor comprising: first planer internal electrodes in electrical contact with a first external termination; second planer internal electrodes interleaved with said first planer internal electrodes wherein said second planer internal electrodes are in electrical contact with a second external termination; a dielectric between said first planer internal electrodes and said second planer internal electrodes; and at least one of said first external termination and said second external termination comprises transient liquid phase sintering adhesive between at least one of said first external termination and said first planer internal electrodes or said second external termination and said second planer internal electrodes wherein said transient liquid phase sintering adhesive has a melting point of above 300° C.
地址 Simpsonville SC US