Thermal conductive adhesive comprising thermal conductive composite powder, thermal dissipation tape of thin film type comprising thereof and method of preparation the same

摘要

The present invention relates to a thermal conductive adhesive including thermal conductive powder, a thin film type heat dissipation tape including the same, and a method for preparation the same. The thin film type heat dissipation tape of the present invention shows improved thermal conductivity and can be used in various fields such as highly integrated electronic products including smartphones.