| 发明名称 | Easily assembled chip assembly and chip assembling method | ||
| 摘要 | A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an adhesive distributed in the through hole. A thickness of the adhesive is less than that of the connecting pad. | ||
| 申请公布号 | US8890326(B2) | 申请公布日期 | 2014.11.18 |
| 申请号 | US201213559622 | 申请日期 | 2012.07.27 |
| 申请人 | Hon Hai Precision Industry Co., Ltd. | 发明人 | Wu Kai-Wen |
| 分类号 | H01L23/48 | 主分类号 | H01L23/48 |
| 代理机构 | Novak Druce Connolly Bove + Quigg LLP | 代理人 | Novak Druce Connolly Bove + Quigg LLP |
| 主权项 | 1. A chip assembly, comprising: a PCB; a connecting pad fixed on the PCB, the connecting pad defining a through hole; and a chip received in the through hole and fixed on the PCB by an adhesive distributed in the through hole, a thickness of the adhesive is less than a thickness of the connecting pad. | ||
| 地址 | New Taipei TW | ||