| 摘要 |
PROBLEM TO BE SOLVED: To provide a chuck for prober which responds to the request of enhancing the throughput of an insection process, and to provide a prober using the same.SOLUTION: A chuck 5 for prober includes an insulating substrate 8 consisting of an alumina sintered body, and having a dielectric loss tangent of 20×10or less at a measurement frequency of 1 MHz, and a first conductive layer 9 arranged on one principal surface of the insulating substrate 8. As a result, the time required until the absorption current disappears can be shortened, when inspecting the electrical characteristics of a semiconductor wafer 2. Consequently, the time required for the inspection is shortened and the throughput of the inspection process can be enhanced. |
