发明名称 |
Magnetic microinductors for integrated circuit packaging |
摘要 |
Magnetic microinductors formed on semiconductor packages are provided. The magnetic microinductors are formed as one or more layers of coplanar magnetic material on a package substrate. Conducting vias extend perpendicularly through the plane of the magnetic film. The magnetic film is a layer of isotropic magnetic material or a plurality of layers of anisotropic magnetic material having differing hard axes of magnetization. |
申请公布号 |
US8884438(B2) |
申请公布日期 |
2014.11.11 |
申请号 |
US201012823968 |
申请日期 |
2010.06.25 |
申请人 |
Intel Corporation |
发明人 |
Gardner Donald S.;Mosley Larry E. |
分类号 |
H01L23/48;H01L21/8242;H01F10/187;H01F41/04;H01F17/00;H01F27/34 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
|
主权项 |
1. A device comprising,
a substrate having a surface, a magnetic film disposed on the substrate surface wherein the magnetic film has non-linear-magnetic properties, and a plurality of conducting vias extending perpendicularly through the magnetic film that has non-linear magnetic properties wherein the plurality of conducting vias extend from a first face of the magnetic film that has non-linear magnetic properties to a second face of the magnetic film that has non-linear magnetic properties. |
地址 |
Santa Clara CA US |