发明名称 Magnetic microinductors for integrated circuit packaging
摘要 Magnetic microinductors formed on semiconductor packages are provided. The magnetic microinductors are formed as one or more layers of coplanar magnetic material on a package substrate. Conducting vias extend perpendicularly through the plane of the magnetic film. The magnetic film is a layer of isotropic magnetic material or a plurality of layers of anisotropic magnetic material having differing hard axes of magnetization.
申请公布号 US8884438(B2) 申请公布日期 2014.11.11
申请号 US201012823968 申请日期 2010.06.25
申请人 Intel Corporation 发明人 Gardner Donald S.;Mosley Larry E.
分类号 H01L23/48;H01L21/8242;H01F10/187;H01F41/04;H01F17/00;H01F27/34 主分类号 H01L23/48
代理机构 代理人
主权项 1. A device comprising, a substrate having a surface, a magnetic film disposed on the substrate surface wherein the magnetic film has non-linear-magnetic properties, and a plurality of conducting vias extending perpendicularly through the magnetic film that has non-linear magnetic properties wherein the plurality of conducting vias extend from a first face of the magnetic film that has non-linear magnetic properties to a second face of the magnetic film that has non-linear magnetic properties.
地址 Santa Clara CA US