发明名称 |
COMPACT MOLDED INTERCONNECT DEVICE FOR AUTOMOTIVE APPLICATIONS |
摘要 |
<p>A compact molded interconnect device for automotive applications is disclosed. The electronic circuit (108) lays on a molded plastic component (110) of the compact molded interconnect device to activate and deactivate the electronic switching, dynamic sensing, electronic activation and electronic deactivation of the control unit. The electronic circuit lays on the molded plastic component comprising a laser direct structuring based electronic circuit.</p> |
申请公布号 |
WO2014177918(A1) |
申请公布日期 |
2014.11.06 |
申请号 |
WO2013IB55560 |
申请日期 |
2013.07.08 |
申请人 |
SATYAM-VENTURE ENGINEERING SERVICES PVT LTD |
发明人 |
JHA, ROSHAN KUMAR;JAYANTHI, BALA SUBRAMANYAM |
分类号 |
B60R25/01 |
主分类号 |
B60R25/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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