发明名称 COMPACT MOLDED INTERCONNECT DEVICE FOR AUTOMOTIVE APPLICATIONS
摘要 <p>A compact molded interconnect device for automotive applications is disclosed. The electronic circuit (108) lays on a molded plastic component (110) of the compact molded interconnect device to activate and deactivate the electronic switching, dynamic sensing, electronic activation and electronic deactivation of the control unit. The electronic circuit lays on the molded plastic component comprising a laser direct structuring based electronic circuit.</p>
申请公布号 WO2014177918(A1) 申请公布日期 2014.11.06
申请号 WO2013IB55560 申请日期 2013.07.08
申请人 SATYAM-VENTURE ENGINEERING SERVICES PVT LTD 发明人 JHA, ROSHAN KUMAR;JAYANTHI, BALA SUBRAMANYAM
分类号 B60R25/01 主分类号 B60R25/01
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