发明名称 DENSE COMPOSITE MATERIAL, PRODUCTION METHOD THEREFOR, JOINED BODY, AND MEMBER FOR SEMICONDUCTOR-MANUFACTURING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a composite material extremely small in difference of a linear thermal expansion coefficient with that of aluminum nitride, and efficiently high in thermal conductivity, denseness and strength.SOLUTION: A dense composite material: contains top three large contents of silicon carbide, titanium silicon carbide and titanium carbide where this order is a descending one; contains the silicon carbide of 51 to 68 mass% and no titanium silicate; and has an open porosity of 1% or less. Characteristics of such the dense composite material are that, for example, an average linear thermal expansion coefficient at 40°C to 570°C is 5.4 to 6.0 ppm/K, a thermal conductivity is 100 W/(m K) or more and a four point flexural strength is 300 MPa or more.
申请公布号 JP2014208567(A) 申请公布日期 2014.11.06
申请号 JP20140017472 申请日期 2014.01.31
申请人 NGK INSULATORS LTD 发明人 SHINDO ASUMI;INOUE KATSUHIRO;KATSUTA YUJI
分类号 C04B35/56;C04B37/00;H01L21/31;H01L21/683 主分类号 C04B35/56
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