SEMICONDUCTOR DEVICE HAVING LANDING PADS

摘要

A semiconductor device including a substrate, the substrate including active regions; a pair of conductive lines spaced apart from the substrate such that an insulating layer is between the substrate and the pair of conductive lines; insulating spacers covering side walls of each of the pair of conductive lines such that contact holes having first widths in a first direction are defined between the pair of conductive lines; upper insulating patterns on the pair of conductive lines, the upper insulating patterns defining landing pad holes connected to the contact holes such that the landing pad holes have second widths in the first direction that are greater than the first widths; contact structures including contact plugs connected to the active regions by passing through the insulating layer, and first landing pads connected to the contact plugs, the first landing pads being in the landing pads holes such that the first landing pads vertically overlap with one of the pair of conductive lines; and capacitor lower electrodes connected to the contact structures.

主权项

1. A semiconductor device, comprising:
a substrate, the substrate including active regions; a pair of conductive lines spaced apart from the substrate such that an insulating layer is between the substrate and the pair of conductive lines; insulating spacers covering side walls of each of the pair of conductive lines such that contact holes having first widths in a first direction are defined between the pair of conductive lines; upper insulating patterns on the pair of conductive lines, the upper insulating patterns defining landing pad holes connected to the contact holes such that the landing pad holes have second widths in the first direction that are greater than the first widths; contact structures including:
contact plugs connected to the active regions by passing through the insulating layer, andfirst landing pads connected to the contact plugs, the first landing pads being in the landing pads holes such that the first landing pads vertically overlap with one of the pair of conductive lines; and capacitor lower electrodes connected to the contact structures.