发明名称 Compact three dimensional vertical NAND and method of making thereof
摘要 A NAND device has at least a 3×3 array of vertical NAND strings in which the control gate electrodes are continuous in the array and do not have an air gap or a dielectric filled trench in the array. The NAND device is formed by first forming a lower select gate level having separated lower select gates, then forming plural memory device levels containing a plurality of NAND string portions, and then forming an upper select gate level over the memory device levels having separated upper select gates.
申请公布号 US8878278(B2) 申请公布日期 2014.11.04
申请号 US201313754293 申请日期 2013.01.30
申请人 Sandisk Technologies Inc. 发明人 Alsmeier Johann;Makala Raghuveer S.;Costa Xiying;Zhang Yanli
分类号 H01L21/84;H01L27/115;G11C16/04;H01L29/788;H01L29/66;H01L29/792;H01L21/764 主分类号 H01L21/84
代理机构 The Marbury Law Group PLLC 代理人 The Marbury Law Group PLLC
主权项 1. A NAND device, comprising: an array of vertical NAND strings, wherein: each NAND string comprises a semiconductor channel, a tunnel dielectric located adjacent to the semiconductor channel, a charge storage region located adjacent to the tunnel dielectric, and a blocking dielectric located adjacent to the charge storage region;at least one end portion of the semiconductor channel extending substantially perpendicular to a major surface of a substrate; andthe array comprises at least a 3×3 array of NAND strings; a plurality of control gate electrodes having a mesh shape extending substantially parallel to the major surface of the substrate, wherein the plurality of control gate electrodes comprise at least a first control gate electrode located in a first device level and a second control gate electrode located in a second device level located over the major surface of the substrate and below the first device level, wherein: the first control gate electrode and the second control gate electrode are continuous in the array.
地址 Plano TX US