发明名称 METHOD FOR REMOVING DEFECT OF THIN FILM AND THE FLEXIBLE SUBSTRATE MANUFACTURED BY THE METHOD
摘要 A method for removing defect in a thin film and a flexible substrate manufactured thereby are provided. The method for removing defect in a thin film comprises forming a seed layer on a substrate; forming an inorganic thin layer on the seed layer; and removing defect generated in a process of forming the inorganic thin layer. Removing the defect is to remove by forming self-assembled monolayers.
申请公布号 KR101457157(B1) 申请公布日期 2014.10.31
申请号 KR20130164225 申请日期 2013.12.26
申请人 UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY 发明人 KIM, SUNG SOO;LEE, JONG GEOL;KIM, HYUN GI
分类号 H01L21/20 主分类号 H01L21/20
代理机构 代理人
主权项
地址