发明名称 CASING UNIT FOR ENCAPSULATING ELEMENTS AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A casing unit for encapsulating elements and a manufacturing method thereof are provided to reduce the manufacturing cost of the casing unit by employing a casing provided with a capsule at which getter is disposed. CONSTITUTION: An air-tight casing unit is provided with capsules for accommodating an organic light-emitting diode display and getter(6) for absorbing impurities in the air. An internal surface of the respective capsules has a large structure(8a) and/or a small structure(8b). The getter(6) is directly disposed at the internal surface. The large structure(8a) is a crater, cone, or column shape surface structure that ranges from 1 to 500μm in size. The small structure(8b) is a crater, cone, or column shape surface structure that ranges from 1 to 1000nm in size.
申请公布号 KR20040014143(A) 申请公布日期 2004.02.14
申请号 KR20030005315 申请日期 2003.01.27
申请人 SAMSUNG SDI CO., LTD. 发明人 HUMBS, WERNER;UHLIG, ALBRECHT;ZABEL, ANDREAS
分类号 H05B33/04;H01L51/52 主分类号 H05B33/04
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