| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate which enables the increase in adhesion between a wiring layer and a substrate.SOLUTION: A method for manufacturing a wiring substrate comprises the steps of: coating a dummy substrate 20 with ink 24 including metal particles and a solvent; forming a porous layer 12 on the ink 24 so that a region 26 where the metal particles and the porous layer are mixed is formed on the side of the ink 24; baking the ink 24, thereby forming a wiring layer 14; and gluing the side of the porous layer opposite to the wiring layer 14 to a substrate 10. |
