发明名称 COOLING PLATE
摘要 PROBLEM TO BE SOLVED: To provide a small, lightweight cooling plate that is able to prevent thermal destruction of a heat generation body, resulting from the temporary overheat of the heat generation body, by solving problems in that heating density is increased by the higher performance of and higher output from an electronic apparatus and a cooling plate with high cooling performance is required in order to prevent thermal destruction while the size and mass allowed for the cooling plate are reduced due to the reductions in the size and weight of the electronic apparatus.SOLUTION: A system of cooling by use of latent heat generated when a substance has a phase change is employed. Paraffin wax or glucose sweetener, which has a high fusing latent heat and is a low density substance, is used as a heat reservoir. Furthermore, a high heat conductive material is contained in the heat reservoir, thereby reducing heat resistance between a heat generation body and the heat reservoir. This achieves reduction in size and weight and cooling of the heat generation body due to temporary overheat of the heat generation body.
申请公布号 JP2014203902(A) 申请公布日期 2014.10.27
申请号 JP20130077366 申请日期 2013.04.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 SHIRAI YASURO;KOBAYASHI YUTAKA;TSUKIDATE RYUJI;HARADA HIRONORI;CHIBA HIROSHI
分类号 H01L23/373;F28D20/00 主分类号 H01L23/373
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