| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting composition that contains a cyanate resin, wherein the cyanate resin has improved heat resistance and dielectric properties and is excellent in moistureproof reliability; a cured product of the thermosetting composition, ; a resin composition for electric substrate, obtained by using the composition; an electronic circuit board obtained by using the composition as a matrix resin; and a novel cyanate resin.SOLUTION: The cyanate resin has a configuration such that a plurality of an aromatic hydrocarbon group (ph1) containing a naphthylmethyloxy group or an anthracenylmethyl group and a cyanato group-containing hydrocarbon group (ph2) are bonded to each other through a divalent nodal group (X). The thermosetting resin composition containing the resin, its cured product, the resin composition for electric substrate obtained by using the composition, and the electronic circuit board obtained by using the composition as the matrix resin are also provided. |
