发明名称 Method for improving device performance using dual stress liner boundary
摘要 An integrated circuit with DSL borders perpendicular to the tranistor gates primarily inside the nwell and with DSL borders parallel to the transistor gates primarily outside the nwell. A method for forming an integrated circuit with DSL borders perpendicular to the tranistor gates primarily inside the nwell and with DSL borders parallel to the transistor gates primarily outside the nwell.
申请公布号 US8859357(B2) 申请公布日期 2014.10.14
申请号 US201113288664 申请日期 2011.11.03
申请人 Texas Instruments Incorporated 发明人 Choi Youn Sung;Baldwin Greg Charles
分类号 H01L21/00;H01L21/8238;H01L27/02;H01L29/78 主分类号 H01L21/00
代理机构 代理人 Garner Jacqueline J.;Telecky, Jr. Frederick J.
主权项 1. A method of forming an integrated circuit, comprising the steps: forming a pmos transistor with a p-active area in an nwell; forming a nmos transistor with an n-active area adjacent to said pmos transistor where a boundary of said nwell is approximately midway between said p-active area and said n-active area; depositing a compressive contact etch stop liner over said pmos transistor and removing it from said nmos transistor; depositing a tensile contact etch stop liner over said nmos transistor and removing it from said pmos transistor; forming a parallel DSL border which lies primarily outside said nwell; and forming a perpendicular DSL border which lies primarily inside said nwell.
地址 Dallas TX US