发明名称 Method of producing a suspension board with circuit
摘要 A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer and having a terminal portion connected to connecting terminals of a magnetic head mounted on a slider. A slider mounting region where the slider is disposed is defined, and a plurality of the terminal portions are spaced apart from each other in the slider mounting region, and in the metal supporting board, an opening which opens so as to expose the insulating layer where the terminal portions are disposed is formed at the slider mounting region.
申请公布号 US8858810(B2) 申请公布日期 2014.10.14
申请号 US201313948488 申请日期 2013.07.23
申请人 Nitto Denko Corporation 发明人 Ishii Jun
分类号 G11B5/48;G11B5/84 主分类号 G11B5/48
代理机构 Edwards Neils PLLC 代理人 Edwards, Esq. Jean C.;Edwards Neils PLLC
主权项 1. A method of producing a suspension board with circuit comprising the steps of: laminating a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer and having a terminal portion connected to a connecting terminal of a magnetic head mounted on a slider; and etching the metal supporting board to form an opening so as to expose an under surface of the insulating layer to an extent that includes a position where the terminal portion is disposed when the opening is projected in a thickness direction of the suspension board with circuit, with the terminal portion being disposed at a slider mounting region where the slider is disposed, wherein the under surface of the insulating layer is exposed over an entire area of the opening.
地址 Osaka JP