发明名称 flip-chip structured group 3 nitride-based semiconductor light emitting diodes and methods to fabricate them
摘要 PURPOSE: A group III nitride-based semiconductor light emitting diode having a flip chip structure is provided to perform a low driving voltage, a low leakage current, and a high external light emitting efficiency property. CONSTITUTION: A group III nitride-based semiconductor light emitting diode having a flip chip structure includes a growing substrate(10), a light emitting structure for an LED device, a super lattice structure(90), a first ohmic contact current spreading layer(100), a second ohmic contact current spreading layer, a third ohmic contact current spreading layer, a p-type schottky contact electrode pad, and an n-type ohmic contact electrode pad. The light emitting structure comprises a bottom nitride-based clad layer(20), a nitride-based active layer(30), and a top nitride-based clad layer(40). The super lattice structure is formed on a partial region or a whole region of a top surface of the top nitride-based clad layer of the light emitting structure for the LED device.
申请公布号 KR101449032(B1) 申请公布日期 2014.10.08
申请号 KR20080033987 申请日期 2008.04.13
申请人 发明人
分类号 H01L33/04;H01L33/22 主分类号 H01L33/04
代理机构 代理人
主权项
地址