| 摘要 |
<p>PROBLEM TO BE SOLVED: To secure a large radius of roundness on an outside surface of a portion where a resin plate is folded, when molding an electronic apparatus casing from the resin plate.SOLUTION: A manufacturing method of a resin casing includes the steps of: processing a resin plate into a shape of planarly deploying a casing; forming on the resin plate a recessed groove part which becomes an origin when folding a portion to be a standing wall of the casing in the resin plate; forming the portion to be the standing wall by folding the resin plate with the recessed groove part as the origin; and joining ridge lines of the portion to be the standing wall with each other. The recessed groove part has a bottom face extending along an outside surface of the portion where the resin plate is folded, and is formed from a plurality of recessed grooves disposed in parallel with each other so as to be arranged side by side in a circumferential direction of roundness generated on the outside surface. Thus, a large value can be secured for a radius of roundness on the outside surface of the portion where the resin plate is folded.</p> |
