FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a film adhesive, a dicing tape with a film adhesive and a semiconductor device manufacturing method, which can prevent a thermal influence on a semiconductor wafer and inhibit warpage of the semiconductor wafer.SOLUTION: A film adhesive includes a thermoplastic resin and conductive particles and has an adhesion force of 0.5 N/10 mm and over which is measured at 25°C after attaching the film adhesive to a mirror silicon wafer at 40°C.