发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.
申请公布号 US2014284639(A1) 申请公布日期 2014.09.25
申请号 US201314077219 申请日期 2013.11.12
申请人 ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. 发明人 LIN HOU-TE;CHEN PIN-CHUAN;CHEN LUNG-HSIN
分类号 H01L33/40;H01L33/38 主分类号 H01L33/40
代理机构 代理人
主权项 1. A light emitting diode (LED) package comprising: a substrate comprising a top surface and a bottom surface; a first electrode and a second electrode spaced from the first electrode, both the first and the second electrodes being embedded in the substrate, both the first and the second electrodes comprising a top face and a bottom face, the top faces of the first and the second electrodes being exposed at the top surface of the substrate, and the bottom faces of the first and the second electrodes being exposed at the bottom surface of the substrate; an LED die mounted on the top surface of the substrate and respectively electrically connected to the first and the second electrodes, the LED die comprising a positive bonding pad (p-pad) and a negative bonding pad (n-pad); and an encapsulation layer covered on the top surface of the substrate to encapsulate the LED die therein; wherein the top face of the first electrode defines a first groove corresponding to the p-pad of the LED die, and at least a portion of the p-pad is inserted into the first groove, an oxidation-resistant metal coating layer being filled between an insertion portion of the p-pad and at least a portion of an inner surface of the first groove.
地址 Hsinchu Hsien TW