发明名称 |
Silane and borane treatments for titanium carbide films |
摘要 |
Methods of treating metal-containing thin films, such as films comprising titanium carbide, with a silane/borane agent are provided. In some embodiments a film including titanium carbide is deposited on a substrate by an atomic layer deposition (ALD) process. The process may include a plurality of deposition cycles involving alternating and sequential pulses of a first source chemical that includes titanium and at least one halide ligand, a second source chemical that includes metal and carbon, where the metal and the carbon from the second source chemical are incorporated into the thin film, and a third source chemical, where the third source chemical is a silane or borane that at least partially reduces oxidized portions of the titanium carbide layer formed by the first and second source chemicals. The treatment can form a capping layer on the metal carbide film. |
申请公布号 |
US8841182(B1) |
申请公布日期 |
2014.09.23 |
申请号 |
US201313829856 |
申请日期 |
2013.03.14 |
申请人 |
ASM IP Holding B.V. |
发明人 |
Chen Jerry;Machkaoutsan Vladimir;Milligan Brennan;Maes Jan Willem;Haukka Suvi;Shero Eric;Blomberg Tom E.;Li Dong |
分类号 |
H01L21/336;H01L21/8234;H01L21/02 |
主分类号 |
H01L21/336 |
代理机构 |
Knobbe, Martens, Olson & Bear, LLP |
代理人 |
Knobbe, Martens, Olson & Bear, LLP |
主权项 |
1. A process for treating a film comprising titanium carbide, the process comprising
depositing a film comprising titanium carbide by an atomic layer deposition process comprising a plurality of deposition cycles, at least one cycle comprising:
contacting a substrate in a reaction space with alternating and sequential pulses of a first source chemical that comprises a titanium halide and a second source chemical that comprises a metal and an organic ligand; and exposing the titanium carbide film to a silane/borane agent, wherein after exposing the titanium carbide film comprises less than about 20% titanium on an atomic basis. |
地址 |
NL |