| 摘要 |
Provided is a reinforcing sheet with which it is possible to produce, through secondary mounting, a semiconductor device that has excellent impact resistance and to make steps for the secondary mounting efficient. Also provided is a process for producing a semiconductor device through secondary mounting using the reinforcing sheet. This reinforcing sheet is for reinforcing a semiconductor device produced through secondary mounting in which a semiconductor device that was produced through primary mounting and has bump electrodes formed on a first main surface thereof has been electrically connected to a wiring board through the bump electrodes. The reinforcing sheet comprises a base layer, a pressure-sensitive adhesive layer, and a thermosetting resin layer in this order, wherein the pressure-sensitive adhesive layer has a breaking strength of 0.07 MPa or greater and a melt viscosity at 60-100ºC of 4,000 Pa·s or less. |
