SPUTTERING APPARATUS FOR REDUCING SUBSTRATE DAMAGE AND METHOD FOR APPLYING THE SAME

摘要

The present disclosure discloses a sputtering apparatus for reducing the damage to the base board caused by ITO sputtering and the method thereof. The sputtering chamber of the sputtering apparatus includes a base board connection structure for setting a base board and a target connection structure for setting a target. The target connection structure makes the target locate on the side of the base board connection structure. The target connection structure forms a precalculated angle with the base board. There is a space between the target and the base board. The target connection structure includes a negative potential generator for generating negative potential. The negative potential is applied to the target which is connected to the target connection structure. The sputtering chamber of the apparatus further includes an anode plate which is in parallel with the target material.

主权项

1. A sputtering apparatus for reducing substrate damage, the sputtering apparatus comprising:
a chamber having a base board; a base board connection structure for setting the base board; a sputtering generating element to generate sputtering particles on the base board connection structure; and a space defined between the base board and the sputtering generating element; wherein, the sputtering plane of the sputtering generating element is placed with a preconfigured angle relative to the surface of the substrate connected to the substrate connection structure.