Heat dissipation system with DIMM baffle

摘要

A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.

主权项

1. A heat dissipation system comprising:
a motherboard comprising a printed circuit board (PCB) and two heat areas located on the motherboard, each of the two heat areas comprising a plurality of dual inline memory module (DIMM) slots, each of the plurality of DIMM slots comprises a buckle; and a DIMM baffle located between the two heat areas; the DIMM baffle comprising a main body, an interval portion, and a clasp located on the main body opposite to the interval portion; the main body is substantially perpendicular to an extending direction of the plurality of DIMM slots; and the clasp comprises a resilient clip and a stand portion located on the resilient clip, wherein the stand portion is engaged with a first buckle of the plurality of buckles, to prevent the DIMM baffle from moving away from the PCB; and the interval portion extends between two of the plurality of DIMM slots, to prevent the DIMM baffle from moving along a first direction that is substantially perpendicular to the extending direction of the plurality of DIMM slots.