METHOD OF MANUFACTURING CONNECTION STRUCTURE

摘要

A method of manufacturing a connection structure which includes a wiring substrate, a first electronic component that is flip-chip mounted on the front surface thereof, and a second electronic component that is flip-chip mounted on the rear surface. The method includes the steps of: temporarily mounting the first electronic component on the front surface of the wiring substrate with a first adhesive film disposed therebetween; temporarily mounting the second electronic component on the rear surface of the wiring substrate with a second adhesive film disposed therebetween, placing, on a pressure bonding receiving base, the wiring substrate on which the first electronic component and the second electronic component are temporarily mounted; and mounting the first electronic component and the second electronic component at a time onto the respective front and rear surfaces of the wiring substrate.

主权项

1. A method of manufacturing a connection structure, the connection structure including a wiring substrate, a first electronic component flip-chip mounted on a front surface thereof, and a second electronic component flip-chip mounted on a rear surface, the method comprising the following steps (a) to (d):
Step (a) a step of temporarily mounting the first electronic component on the front surface of the wiring substrate with a first adhesive film disposed therebetween; Step (b) a step of temporarily mounting the second electronic component on the rear surface of the wiring substrate with a second adhesive film disposed therebetween, the second adhesive film having a curing temperature lower than a curing temperature of the first adhesive film; Step (c) a step of placing, on a pressure bonding receiving base, the wiring substrate on which the first electronic component and the second electronic component are temporarily mounted; and Step (d) a step of heating the first electronic component while pressing the first electronic component against the wiring substrate with a heating and pressing tool from the side of the first electronic component, thereby mounting at a time the first electronic component and the second electronic component onto the respective front and rear surfaces of the wiring substrate.