METHOD TO PACKAGE MULTIPLE MEMS SENSORS AND ACTUATORS AT DIFFERENT GASES AND CAVITY PRESSURES

摘要

A method for fabricating a multiple MEMS device. A semiconductor substrate having a first and second MEMS device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel, can be provided. The first MEMS can be encapsulated within the first cavity and the second MEMS device can be encapsulated within the second cavity. These devices can be encapsulated within a provided first encapsulation environment at a first air pressure, encapsulating the first MEMS device within the first cavity at the first air pressure. The second MEMS device within the second cavity can then be subjected to a provided second encapsulating environment at a second air pressure via the channel of the second cavity.

主权项

1. A method for fabricating a multiple MEMS device comprising:
providing a semiconductor substrate having a first MEMS device and a second MEMS device; providing an encapsulation wafer comprising a first cavity and a second cavity, wherein the second cavity comprises at least one channel; providing a first encapsulation environment at a first air pressure; encapsulating the first MEMS device within the first cavity and the second MEMS device within the second cavity, while within the first encapsulation environment, to encapsulate the first MEMS device within the first cavity at the first air pressure; providing a second encapsulating environment at a second air pressure, wherein the second air pressure is different from the first air pressure; subjecting the second MEMS device within the second cavity to the second encapsulation environment via the at least one channel; and sealing the at least one channel, while within the second encapsulation environment, to encapsulate the second MEMS device within the second cavity at the second air pressure.