发明名称 |
MEMBRANE SHEET WITH BUMPS FOR PROBE CARD, PROBE CARD AND METHOD FOR MANUFACTURING MEMBRANE SHEET WITH BUMPS FOR PROBE CARD |
摘要 |
A probe card is for testing a wafer which allows for stable contact with electrode pads of a wafer simultaneously under small contact pressure in wafer test procedures. A probe card includes a frame plate which is provided with a plurality of through-holes corresponding to semiconductor chips of a wafer, a wiring substrate, an anisotropic conductive membrane which has a size corresponding to that of the through-hole and is fixed in the through-hole or on a periphery of the through-hole in the frame plate, and a contact membrane which also has a size corresponding to that of the through-hole and is fixed on the periphery of the through-hole in the frame plate. The contact membrane includes an insulating membrane, a conductive electrode provided in the insulating membrane and on a reverse face of the insulating membrane, and a bump. The bump is formed by plating an upper end of an electrode body which is exposed by half-etching the insulating membrane. The bump has a pointy tip end portion is electrically contacted with a terminal in the wiring substrate via a conductive path in the anisotropic conductive membrane. |
申请公布号 |
KR20140099179(A) |
申请公布日期 |
2014.08.11 |
申请号 |
KR20137031743 |
申请日期 |
2012.12.04 |
申请人 |
ELFINOTE TECHNOLOGY CORPORATION |
发明人 |
TAGO TOSHIO;ISHIZAKA MASAAKI |
分类号 |
G01R1/073;G01R31/26;H01L21/66 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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