发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 A transistor device comprising epitaxial LDD and Halo regions and a method of manufacturing the same are disclosed. According to embodiments of the present disclosure, the method may comprise: forming a gate stack on a semiconductor substrate; forming a gate spacer which covers the top of the gate stack and sidewalls of the gate stack; forming source/drain grooves; epitaxially growing a Halo material layer in the source/drain grooves, wherein the Halo material layer has a first doping element therein; epitaxially growing source/drain regions which apply stress to a channel region of the device, wherein the source/drain regions have a second doping element, opposite in conductivity to the first doping element, therein; isotropically etching the source/drain regions to remove portions of the source/drain regions, wherein the etching also removes portions of the Halo material layer directly under the gate spacer and extends to the channel region to some extent, wherein remaining portions of the Halo material layer constitute Halo regions of the device; and epitaxially growing an LDD material layer to form LDD regions of the device.
申请公布号 US2014217519(A1) 申请公布日期 2014.08.07
申请号 US201213989297 申请日期 2012.07.30
申请人 Qin Changliang;Yin Huaxiang 发明人 Qin Changliang;Yin Huaxiang
分类号 H01L29/78;H01L29/66 主分类号 H01L29/78
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, the method comprising: forming a gate stack on a semiconductor substrate; forming a gate spacer which covers the top of the gate stack and sidewalls of the gate stack; forming source/drain grooves; epitaxially growing a Halo material layer in the source/drain grooves, wherein the Halo material layer has a first doping element therein; epitaxially growing source/drain regions which apply stress to a channel region of the device, wherein the source/drain regions have a second doping element, opposite in conductivity to the first doping element, therein; isotropically etching the source/drain regions to remove portions of the source/drain regions, wherein the etching also removes portions of the Halo material layer directly under the gate spacer and extends to the channel region to some extent, wherein remaining portions of the Halo material layer constitute Halo regions of the device; and epitaxially growing an LDD material layer to form LDD regions of the device.
地址 Beijing CN