发明名称 HEAT INSULATION FLOOR MEMBER FOR DOUBLE FLOORING
摘要 PROBLEM TO BE SOLVED: To decrease reduction of heat insulation in portions of support legs, to improve a sound absorption performance and a sound-proof performance and further to improve workability in a heat insulation floor member for double flooring for forming a double flooring structure of a free-access floor.SOLUTION: A heat insulation member 10 for double flooring is formed from a plate-like lower floor panel 11 placed on a foundation floor surface 1 and an upper floor panel 21 including, at a bottom face side, a plurality of support legs 23 placed on the lower floor panel 11. The lower floor panel 11 is formed from support leg receiving parts 13 provided at positions where the support legs 23 of the upper floor panel are placed, and a heat insulation material 17 filling gaps between the support leg receiving parts 13. On top faces of the support leg receiving parts 13, positioning engagement parts 15 are provided which are engaged with the support legs 23 of the upper floor panel 21.
申请公布号 JP2014133998(A) 申请公布日期 2014.07.24
申请号 JP20130001562 申请日期 2013.01.09
申请人 INOAC HOUSING & CONSTRUCTION MATERIALS CO LTD 发明人 YAMADA MASAYUKI
分类号 E04F15/024 主分类号 E04F15/024
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