发明名称 SYSTEM AND METHOD FOR DESIGNING VIA OF PRINTED CIRCUIT BOARD
摘要 A via design method includes doing a simulation according to input data to obtain the impedance of the via of the reference printed circuit board (PCB). An optimal via model is determined according to a group of input data. Simulating is performed according to the thickness of a PCB to-be-designed and the optimal via model data, to obtain the impedance of a via of a PCB to be designed. The number of the anti-pads of the via of the PCB to be designed is recorded when the difference between the impedance of the via of the PCB to be designed and the impedance of the via model of the reference PCB does not fall within a preset range. An interval between each two adjacent anti-pads of the via of the PCB to designed is determined according to the recorded number and the thickness of the PCB to be designed.
申请公布号 US2014208286(A1) 申请公布日期 2014.07.24
申请号 US201313967349 申请日期 2013.08.15
申请人 HON HAI PRECISION INDUSTRY CO., LTD. ;HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. 发明人 WEI MING;PAI CHIA-NAN;HSU SHOU-KUO
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
主权项 1. A design system for designing a via of a printed circuit board (PCB), comprising: one or more processors; and a plurality of modules executed by the one or more processors to perform operations of designing a via of a PCB, the operations comprising: doing a simulation according to input data to obtain the impedance of the via of a reference PCB; determining an optimal via model according to a group of input data, the impedance of the via of the reference PCB obtained according to the group of input data being optimal, the optimal via model data comprising the diameter of a hole, a pad, and an anti-pad of the optimal via model, and the number of the anti-pads of the optimal via model; doing a simulation according to the thickness of a PCB to-be-designed and the optimal via model data, to obtain the impedance of a via of a PCB to be designed; determining whether a difference between the impedance of the via of the PCB to be designed and the impedance of the via model of the reference PCB falls within a preset range; prompting designers to adjust the number of the anti-pads of the via of the PCB to be designed when the difference between the impedance of the via of the PCB to be designed and the impedance of the via model of the reference PCB does not fall within the preset range; doing a simulation when the number of the anti-pads of the via of the PCB to be designed changes to obtain the impedance of the via of the PCB to be designed recording the number of the anti-pads of the via of the PCB to be designed when the difference between the impedance of the via of the PCB to be designed and the impedance of the via model of the reference PCB falls within the preset range; determining an interval between each two adjacent anti-pads of the via of the PCB to designed according to the recorded number of the anti-pads and the thickness of the PCB to be designed; and displaying the data consisting of the via of the PCB to be designed, the data comprising the diameter of a hole, a pad, and an anti-pad of the via model, the number of the anti-pads of the via of the PCB to be designed, and the interval between each two adjacent anti-pads of the via of the PCB to designed.
地址 New Taipei TW