发明名称 Methods for fabricating a cell string and a non-volatile memory device including the cell string
摘要 A method for fabricating a cell string includes forming an interlayer dielectric layer, a sacrificial layer, and a semiconductor pattern on a semiconductor substrate, such that the interlayer dielectric layer and the sacrificial layer are formed in a first direction parallel with the semiconductor substrate, and such that the semiconductor pattern is formed in a second direction perpendicular to the semiconductor substrate, forming an opening by patterning the interlayer dielectric layer and the sacrificial layer, filling the opening with a metal, and annealing the semiconductor pattern having the opening filled with the metal.
申请公布号 US8785276(B2) 申请公布日期 2014.07.22
申请号 US201113198143 申请日期 2011.08.04
申请人 Samsung Electronics Co., Ltd. 发明人 Nakanishi Toshiro;Lee Choong-Man
分类号 H01L21/336;H01L21/4763;H01L29/792;H01L29/76 主分类号 H01L21/336
代理机构 Lee & Morse, P.C. 代理人 Lee & Morse, P.C.
主权项 1. A method for fabricating a cell string, the method comprising: forming an interlayer dielectric layer, a sacrificial layer, and a semiconductor pattern on a semiconductor substrate, such that the interlayer dielectric layer and the sacrificial layer are formed in a first direction parallel with the semiconductor substrate, and such that the semiconductor pattern is formed in a second direction perpendicular to the semiconductor substrate; forming an opening by patterning the interlayer dielectric layer and the sacrificial layer; filling the opening with a metal, such that the metal contacts the sacrificial layer to form an interface between the metal and the sacrificial layer; and annealing the semiconductor pattern having the opening filled with the metal.
地址 Suwon-si, Gyeonggi-do KR