ORGANIC-INORGANIC HYBRID PARTICLE, CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

摘要

Provided is an organic-inorganic hybrid particle capable of improving the adhesiveness between an inorganic shell and a contact object contacting the inorganic shell. This organic-inorganic hybrid particle (11) is provided with an organic core (12) and an inorganic shell (13) arranged on the surface of the organic core (12). Silicon atoms contained in the organic core (12) make up 10 wt% or less of 100 wt% of the organic core (12), and carbon atoms contained in the organic core (12) make up 50 wt% or more thereof. Silicon atoms contained in the inorganic shell (13) make up 50 wt% or greater of the 100 wt% of the inorganic shell (13), and the carbon atoms contained in the inorganic shell (13) make up 30 wt% or less thereof. The ratio of the thickness of the inorganic shell (13) to the radius of the organic core (12) is 0.05-0.70.