| 摘要 |
This invention miniaturizes a microphone while maintaining the properties of a microphone chip, and in particular, achieves smaller area of the mounting area. A package is configured by a cover (14) and a substrate (15). A circuit element (13) is mounted on an upper surface of the substrate (15), and a microphone chip (12) i's installed on the circuit element (13). A microphone terminal (23) arranged on the microphone chip (12) and an input/output terminal (24) arranged on the circuit element (13) are connected by a bonding wire (27), and an input/output terminal (25a) and a ground terminal (25b) arranged on the circuit element (13) and pad portions (26a, 26b) of the substrate (15) are connected by a bonding wire (28). An acoustic perforation (16) for transmitting acoustic vibration to the package is opened in the cover (14). |
