Semiconductor Device and Method of Forming Low Profile Fan-Out Package with Vertical Interconnection Units

摘要

A semiconductor device includes a semiconductor die. A first interconnect structure is disposed over a peripheral region of the semiconductor die. A semiconductor component is disposed over the semiconductor die. The semiconductor component includes a second interconnect structure. The semiconductor component is disposed over the semiconductor die to align the second interconnect structure with the first interconnect structure. The first interconnect structure includes a plurality of interconnection units disposed around first and second adjacent sides of the semiconductor die to form an L-shape border of the interconnection units around the semiconductor die. A third interconnect structure is formed over the semiconductor die perpendicular to the first interconnect structure. An insulating layer is formed over the semiconductor die and first interconnect structure. A plurality of vias is formed through the insulating layer and into the first interconnect structure with the second interconnect structure disposed within the vias.

主权项

1. A method of making a semiconductor device, comprising:
providing a semiconductor die; disposing a first modular interconnect structure along a peripheral region of the semiconductor die; providing a semiconductor component including a second interconnect structure formed over the semiconductor component; and disposing the semiconductor component over the semiconductor die to align the second interconnect structure with the first modular interconnect structure.