METHOD OF MANUFACTURING PRESSURE-WELDED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a pressure-welded semiconductor device capable of manufacturing a pressure-welded semiconductor device by assembling undistorted components.SOLUTION: There is provided a method of manufacturing a pressure-welded semiconductor device comprising: a component arranging step of arranging components of a pressure-welded semiconductor device including a semiconductor chip inside a housing; a pressing structural member mounting step of mounting a pressing structural member contacting the semiconductor chip on the semiconductor chip; a lid attaching step of covering the housing with a lid over the pressing structural member; a pressing step of applying a predetermined pressure to between the lid and the housing; and a joining step of joining the lid and the housing after the pressing in the pressing step.