Light Emitting Device and Luminaire

摘要

According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous exitance of the light-emitting element section is equal to or higher than 101 m/mm2 and equal to or lower than 1001 m/mm2. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.

主权项

1. A light-emitting device comprising:
a light-emitting section including:
a mounting substrate section including:
an insulative substrate including a first principal plane including a mounting region and a second principal plane on an opposite side of the first principal plane;a first metal layer provided on the first principal plane and including a plurality of mounting patterns provided in the mounting region; anda second metal layer provided on the second principal plane and electrically insulated from the first metal layer, at least a part of the second metal layer overlapping the mounting region when projected on a first plane parallel to the first principal plane;a light-emitting element section including:
a plurality of semiconductor light-emitting elements provided on the first principal plane, each of the plurality of semiconductor light-emitting elements being electrically connected to any one mounting pattern among the plurality of mounting patterns and another one mounting pattern adjacent to the mounting pattern among the plurality of mounting patterns; anda wavelength conversion layer configured to cover at least parts of the plurality of semiconductor light-emitting elements, absorb at least a part of first light emitted from the plurality of semiconductor light-emitting elements, and emit second light having a wavelength different from a wavelength of the first light, luminous exitance of light emitted from the light-emitting element section being equal to or higher than 101 m/mm2 and equal to or lower than 1001 m/mm2; a thermal radiation member opposed to the second principal plane and having an area equal to or larger than five times an area of the mounting region when projected on the first plane; and a heat conduction layer provided between the thermal radiation member and the second metal layer.