| 摘要 |
The present invention relates to a method for cleaning a chamber comprising: a process of allowing raw gas for cleaning to flow inside the chamber; a process of cleaning the inside of the chamber by adjusting the gap between a substrate support installed inside the chamber and a gas sprayer installed facing the substrate support as a first gap; a process of cleaning the inside of the chamber by adjusting the gap between the substrate support and the gas sprayer as a second gap wider than the first gap; and a process of cleaning the inside of the chamber by adjusting the gap between the substrate support and the gas sprayer as a third gap wider than the first gap but narrower than the second gap. Each above-mentioned process is conducted at least once to clean the chamber. Furthermore, the present invention precisely controls the cleaning process for each area hence damages which may be put on the parts located inside the chamber are reduced. |
