| 摘要 |
[Problem] To address the below-described problems of conventional techniques: - lengthy distance between a chip and a mirror after bonding, - insufficient mechanical strength resulting from joining gold to gold, and - chemical damage to the optical waveguide. [Solution] A structure prepared for a via for electrical connection is formed in a multilayered structure where an electrical circuit substrate and an optical waveguide layer are laminated. The surface of an electrode pad is plated with solder. A layer of the optical waveguide is formed to cover the solder. The optical waveguide layer above the portion plated with the solder is removed to expose the portion plated with the solder. Further, an element is prepared, the element having both a light emitting body or a light receiving body for optically communicating with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion where the optical waveguide layer has been removed, and the plated solder is melted so that the electrode pad on the electric circuit substrate and the tip end of the inserted stud (pillar) are bonded together. The problems in the conventional techniques are addressed with: - reduced distance between a chip and a mirror after bonding, - increased strength of bonded metals using solder, and - minimal damage to the optical waveguide by exclusion of the plating process. |
