PRINTED CIRCUIT BOARD, COMPONENT AND CIRCUIT ASSEMBLY

摘要

Provided are a printed circuit board, a component and a circuit assembly. The printed circuit board (21) is used for welding a component, and a welding material stopping layer (24) is provided on a welding surface of the printed circuit board (21) which is used for welding the component; and the welding material stopping layer (24) is used for limiting a welding material used for welding the component in at least two areas divided by the welding material stopping layer (24). By way of providing a welding material stopping layer (24) on a welding surface of a printed circuit board (21) or on a welding surface of a component, or providing the welding material stopping layer (24) between the welding surfaces of the printed circuit board (21) and the component, the flow of soldering tin can be controlled by the welding material stopping layer (24) in the welding process, so as to improve the distribution uniformity of the soldering tin on the welding surfaces, thereby preventing a large-area cavity from occurring between the welding surfaces after welding, guaranteeing the welding effect, and thereby guaranteeing the product reliability.